View AS1371-BTDT-105_4522916.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Datasheet
AS1371
4 0 0 m A , L o w I n p u t Vo l ta g e , L o w Q u i e s c e n t C u r r e n t L D O
1 General Description
The AS1371 low input voltage, positive voltage regulator is designed to deliver up to 400mA while consuming typically only 15A of quiescent current. The device operates from input voltages of 1.2V to 3.6V, and is available in fixed output voltages between 0.6V and 3.3V (programmable in 50mV steps). Operation at the full 400mA load current is dependent upon the maximum power dissipation available from package and environment. The low input voltage and ultra-low dropout voltage (20mV @ 100mA load and 80mV @ 400mA load) supports single primary cell operation in small applications, when operated with minimum input-tooutput voltage differentials. In addition, the regulator provides a power management life extension by operating from pre-existing 1.8V and 2.5V outputs to provide low output voltages for new generation portable processor cores. The device features stable output voltage with ceramic capacitors down to a value of 1F, strict output voltage regulation tolerances (1%), and good line- and loadregulation. The AS1371 is available in a 6-pin 2x2 TDFN package and is qualified for -40C to +85C operation.
2 Key Features
! ! ! ! ! ! ! ! ! ! ! ! ! ! !
Ultra-Low Dropout Voltage: 20mV @ 100mA load Operating Input Voltage Range: 1.2V to 3.6V Output Voltages: 0.6V to 3.3V in 50mV steps Max. Output Current: 400mA Output Voltage Accuracy: 1% Low Shutdown Current: 10nA Low Quiescent Current: 50A @ max load Integrated Overtemperature/Overcurrent Protection Under-Voltage Lockout Feature Chip Enable Input Power-OK and Low Battery Detection Sense Input Option Minimal External Components Required Operating Temperature Range: -40C to +85C 6-pin 2x2 TDFN Package
3 Applications
The devices are ideal for powering cordless and mobile phones, MP3 players, CD and DVD players, PDAs, hand-held computers, digital cameras, and any other hand-held and/or battery-powered device.
Figure 1. AS1371 - Typical Application Diagram
Input 1.2V to 3.6V CIN 1F ON OFF IN OUT
Output 0.6V to 3.3V COUT 1F
AS1371
EN POK
100k
GND
SENSE
www.austriamicrosystems.com
Revision 1.04
1 - 14
AS1371
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
IN 1
6 OUT
POK 2
AS1371
Exposed Pad
5 SENSE
EN 3
4 GND
Pin Descriptions
Table 1. Pin Descriptions Pin Name IN POK EN GND SENSE OUT GND Pin Number 1 2 3 4 5 6 Exposed Pad Description LDO Input. Input voltage range: 1.2V to 3.6V. Bypass with 1F to GND. Power-OK Output. Active-low, open-drain output indicates an out-ofregulation condition. Connect a 100k pull-up resistor to pin OUT for logic levels. Leave this pin unconnected if the Power-OK feature is not used. Active-High Enable Input. A logic low reduces the supply current to < 1A. Connect to pin IN for normal operation. Ground. This pin also functions as a heat sink. Solder it to a large pad or to the circuit-board ground plane to maximize power dissipation. Sense Input. Represents the input for the Power-OK behaviour. If connected to GND the POK output is related to OUT. LDO Output. Bypass with 1F to GND. Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad or to the circuit-board ground plane to maximize power dissipation. Internally it is connected GND.
www.austriamicrosystems.com
Revision 1.04
2 - 14
AS1371
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter IN and EN to GND POK and OUT to GND Output Short-Circuit Duration Thermal Resistance JA Junction Temperature TJ Operating Temperature Range Storage Temperature Range -40 -65 Min -0.3 -0.3 Indefinite +78.6 +150 +85 +150 Max +5.0 VIN + 0.3 Units V V V C/W C C C The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD020D "Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices". The lead finish for Pb-free leaded packages is matte tin (100% Sn). Internally limited Notes
Package Body Temperature
+260
C
www.austriamicrosystems.com
Revision 1.04
3 - 14
AS1371
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VIN = VOUT (Nominal) + 0.5V, EN = IN, CIN = COUT = 1F, TAMB = -40C to +85C (unless otherwise specified). Typical Values are at TAMB = +25C. Table 3. Electrical Characteristics Symbol VIN VOUT Parameter Input Voltage Output Voltage Available in 50mV steps, see Ordering Information on page 13 TAMB = +25C, IOUT = 1mA, VOUT > 1V Output Voltage Accuracy TAMB = -40 to +85C, IOUT = 1mA, VOUT > 1V Conditions Min 1.2 0.6 -1 -2.7 400 650 IOUT = 0mA IOUT = 400mA IOUT = 100mA IOUT = 400mA IOUT = 1mA IOUT = 1mA to 400mA f = 10Hz to 100kHz, IOUT = 10mA f = 10kHz, IOUT = 10mA -15 15 50 20 80 0 0.003 100 50 +15 50 20 Typ Max 3.6 3.3 +1 % +2.7 mA mA A Units V V
IOUT ILIM IQ
Maximum Output Current Current Limit Quiescent Current
1
VIN-VOUT VLNR VLDR
Dropout Voltage
mV mV %/mA VRMS dB
Line Regulation Load Regulation Output Voltage Noise
PSRR Shutdown tON IOFF VIH VIL IEN
2
Output Voltage AC Power-Supply Rejection Ratio
Exit Delay from Shutdown Enable Supply Current
3,4
90 EN = GND, TAMB = +25C EN = GND, TAMB = +85C 1.0 0.01 0.04
150 1
s A
Enable Input Threshold EN = IN or GND, TAMB = +25C EN = IN or GND, TAMB = +85C
0.4 0.03 0.2 100
V
Enable Input Bias Current
nA
Power-OK Output VPOK Power-OK Voltage Threshold Power-OK Sense Voltage Threshold POK Output Voltage Low POK Output Leakage Current
5
SENSE = GND, VPOKFALLING SENSE = GND, Hysteresis VOUT = 1.05V, VSENSE falling Hysteresis ISINK = 100A 0 VPOK 3.6V, TAMB = +25C, VOUT in regulation
90
94 1
97
% VOUT
VSENSE VOL IPOK
650
800 50
950
mV V A
0.4 1
www.austriamicrosystems.com
Revision 1.04
4 - 14
AS1371
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 3. Electrical Characteristics Symbol Thermal Protection TSHDN TSHDN Thermal Shutdown Temperature Thermal Shutdown Hysteresis 150 15 C C Parameter Conditions Min Typ Max Units
1. Dropout voltage = VIN - VOUT when VOUT is 100mV < VOUT for VIN = VOUT(NOM) +0.5V (applies only to output voltages 1.3V). 2. The rise and fall time of the shutdown signal must not exceed 1ms. 3. The delay time is defined as time required to set VOUT to 95% of its final nominal value. 4. Guaranteed by design. 5. The functionality is proven by production test, limits are guaranteed by design. Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods.
www.austriamicrosystems.com
Revision 1.04
5 - 14
AS1371
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
VOUT = 1.8V, VIN = 2.3V, IOUT = 1mA, TAMB = +25C (unless otherwise specified). Figure 3. Output Voltage vs. Temperature
1.9 1.875
Figure 4. Line Regulation, VOUT vs. VIN;
1.9 1.875
Output Voltage (V)
1.825 1.8 1.775 1.75 1.725 1.7 -40
no load Iout = 10mA
Output Voltage (V)
1.85
1.85 1.825 1.8 1.775 1.75 1.725 1.7
- 40C + 25C + 85C
-20
0
20
40
60
80
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Temperature (C) Figure 5. Load Regulation, VOUT vs. IOUT;
1.9 1.875
Input Voltage (V) Figure 6. Quiescent Current vs. Input Voltage
100 90
no load Iout = 100mA Iout = 400mA
Output Voltage (V)
1.85 1.825 1.8 1.775 1.75 1.725 1.7 0 50 100 150 200 250 300 350 400
- 40C + 25C + 85C
Quiescent Current (A)
80 70 60 50 40 30 20 10 0 2.2 2.4
2.6
2.8
3
3.2
3.4
3.6
Output Current (mA) Figure 7. POK Voltage Threshold vs. Temperature
100 99
Input Voltage (V) Figure 8. Dropout Voltage vs. Output Current
100 90
Output Voltage (% of Voutnom)
97 96 95 94 93 92 91 90 -40
POK rising POK f alling
Dropout Voltage (mV)
98
80 70 60 50 40 30 20 10 0
- 40C + 25C + 85C
-20
0
20
40
60
80
0
50
100 150
200 250 300 350 400
Temperature (C) www.austriamicrosystems.com Revision 1.04
Output Current (mA) 6 - 14
AS1371
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 9. Line Transient Response; VIN = 2.3V to 2.8V, no load
Figure 10. Load Transient Response; IOUT = 0mA to 100mA
500mV/Div
500mV/DIV
100ms/Div
100ms/Div
Figure 11. Turn ON
Figure 12. Turn OFF
1V/Div
500mV/DIV
VOUT
20s/Div
20s/Div
www.austriamicrosystems.com
Revision 1.04
500mV/DIV
VOUT
1V/Div
EN
EN
500mV/DIV
VOUT
VOUT
50mA/Div
VIN
IOUT
7 - 14
AS1371
Datasheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS1371 is a low-dropout, low-quiescent-current linear regulator intended for LDO regulator applications where output current load requirements range from no load to 400mA. All devices come with fixed output voltage from 0.6V to 3.3V. (see Ordering Information on page 13). The AS1371 also features a Power-OK output to indicate when the output is within 10% (max) of final value, and also an Enable pin. Shutdown current for the whole regulator is typically 10nA. The device features integrated short-circuit and over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying (e.g. in a battery powered application). Thermal Protection shuts down the device when die temperature reaches 150C. This is a useful protection when the device is under sustained short circuit conditions. As illustrated in Figure 13, the devices comprise voltage reference, error amplifier, P-channel MOSFET pass transistor, Power-OK detect logic, internal voltage divider, current limiter, thermal sensor and shutdown logic. The bandgap reference is connected to the inverting input of the error amplifier. The error amplifier compares this reference with the feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference voltage, the P-channel MOSFET gate is pulled lower, allowing more current to pass to the output, and increases the output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to pass to the output. The output voltage feeds back through an internal resistor voltage divider connected to pin OUT.
Figure 13. AS1371 - Block Diagram
AS1371
IN EN
Thermal Overload Protection Shutdown/ Power-On Control Logic Error Amplifier +
OUT
Bandgap Voltage & Current Reference
Trimmable Reference Voltage
SENSE POK
Power-OK Compare Logic NMOS
GND
Output Voltages
Standard products are factory-set with output voltages from 0.6V to 3.3V. A two-digit suffix of the part number identifies the nominal output (see Ordering Information on page 13). Non-standard devices are available. For more information contact: http://www.austriamicrosystems.com/contact-us
www.austriamicrosystems.com
Revision 1.04
8 - 14
AS1371
Datasheet - D e t a i l e d D e s c r i p t i o n
Power-OK and Low-Battery-Detect Functionality
The AS1371's power-ok or low-battery-detect circuitry is built around an N-channel MOSFET. The circuitry monitors the voltage on pin SENSE and if the voltage goes out of regulation (e.g. during dropout, current limit or thermal shutdown) the pin POK goes low. The pin SENSE can be connected to a resistive-divider to monitor a particular definable voltage and compare it with an internal voltage reference. If the SENSE pin is connected to GND an internal resistive-divider is activated and connected to the output. Therefore, the Power-OK functionality can be realised with no additional external components. The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to VIN = 1.2V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output, connect a pull-up resistor from pin POK to pin OUT. Larger values for this resistor will help to minimize current consumption; a 100k resistor is perfect for most applications (see Figure 1 on page 1). For the circuit shown in the left of Figure 14 on page 11, the input bias current into SENSE is very low, permitting largevalue resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as possible. Use a defined resistor for R2 and then calculate R1 as:
V IN R 1 = R 2 x ------------------ - 1 V SENSE Where: VSENSE .... Is the internal sense reference voltage. For values see Table 3 on page 4. R2 .... Is the predefined resistor in the resistor divider.
(EQ 1)
In case of the SENSE pin is connected to GND, an internal resistor-divider network is activated and compares the output voltage with a 94% (typ.) voltage threshold. For this particular Power-OK application, no external resistive components are necessary.
Current Limiting
The AS1371 include current limiting circuitry to protect against short-circuit conditions. The circuitry monitors and controls the gate voltage of the P-channel MOSFET, limiting the output current to 400mA. The P-channel MOSFET output can be shorted to ground for an indefinite period of time without damaging the device.
Thermal-Overload Protection
The devices are protected against thermal runaway conditions by the integrated thermal sensor circuitry. Thermal shutdown is an effective instrument to prevent die overheating since the power transistor is the principle heat source in the device. If the junction temperature exceeds 150C with 15C hysteresis, the thermal sensor starts the shutdown logic, at which point the P-channel MOSFET is switched off. After the device temperature has dropped by approximately 15C, the thermal sensor will turn the P-channel MOSFET on again. Note that this will be exhibited as a pulsed output under continuous thermal-overload conditions. Note: The absolute maximum junction-temperature of +150C should not be exceeding during continual operation.
www.austriamicrosystems.com
Revision 1.04
9 - 14
AS1371
Datasheet - D e t a i l e d D e s c r i p t i o n
Operating Region and Power Dissipation
Maximum power dissipation is determined by the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of air flow. The power dissipation of the device is calculated by: P = I OUT x ( V IN - V OUT ) Maximum power dissipation is calculated by: T J - T AMB P MAX = ----------------------- JB + JA Where: TJ - TAMB is the temperature difference between the device die junction and the surrounding air. (EQ 3) (EQ 2)
JB is the thermal resistance of the package. JA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding.
Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin should be connected to the system ground using a large pad or a ground plane.
www.austriamicrosystems.com
Revision 1.04
10 - 14
AS1371
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
9 Application Information
Capacitor Selection and Regulator Stability
Ceramic capacitors are highly recommended as they offer distinct advantages over their tantalum and aluminum electrolytic components. For stable operation with load currents up to 400mA over the entire device temperature range, use a 1F (min) ceramic output capacitor with an ESR <0.2. Use large output capacitor values (e.g. 10F) to reduce noise and improve load transient-response, stability and power-supply rejection. Note: Some ceramic capacitors exhibit large capacitance and ESR variations with variations in temperature.
Power Supply Rejection Ratio
The AS1371 is designed to deliver low dropout voltages and low quiescent currents. Power-supply rejection is typically 50dB at 10kHz. To improve power supply-noise rejection and transient response, increase the values of the input and output bypass capacitors, which are shown in Figure 14. The Section 6 Electrical Characteristics on page 4 show also the device line- and load-transient responses.
Dropout Voltage
For standard products with output voltage greater than the minimum VIN (1.2V), the minimum input-output voltage differential (dropout voltage) determines the lowest usable supply voltage. This determines the useful end-of-life battery voltage in battery-powered systems. The dropout voltage is a function of the P-MOSFET drain-to-source onresistance multiplied by the load current, and is calculated by: V DROPOUT = V IN - V OUT = R DS ( ON ) x I OUT Where: RDS(ON) is the drain-to-source on -resistance. IOUT is the output current. (EQ 4)
Figure 14. Application Diagrams
External Voltage Level Detection (Input Monitoring) Input 1.2V to 3.6V CIN 1F ON / OFF IN OUT Output 0.6V to 3.3V RPU 100k COUT 1F ON / OFF
Internal Voltage Level Detection (Output Monitoring) Input 1.2V to 3.6V CIN 1F IN OUT Output 0.6V to 3.3V RPU 100k COUT 1F
AS1371
EN POK
AS1371
EN POK
GND R1
SENSE
GND
SENSE
R2
www.austriamicrosystems.com
Revision 1.04
11 - 14
AS1371
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in a 6-pin 2x2 TDFN package. Figure 15. 6-pin 2x2 TDFN package Diagram
D A D/2 INDEX AREA D/2 x E/2 B INDEX AREA (D/2 x E/2) PIN#1 ID E/2 D2 e L b CA B BOTTOM VIEW A3 EXPOSED PAD Terminal Tip
aaa C
aaa C TOP VIEW
ccc C
E
bbb
A
B SEATING PLANE
0.08 C SIDE VIEW
Table 4. 6-pin 2x2 TDFN package Dimensions Symbol Min Typ A 0.51 0.55 A1 0.00 0.02 A3 0.15 ref aaa 0.15 bbb 0.10 ccc 0.10 D 1.95 2.00 E 1.95 2.00 Note: 1. 2. 3. 4. 5.
A1
Max 0.60 0.05
2.05 2.05
Symbol D2 E2 L N ND NE e b
Min 1.30 0.85 0.15
0.20
Typ 1.45 1.00 0.25 6 3 3 0.50 0.25
Max 1.55 1.10 0.35
0.32
Dimensioning and tolerancing conform to ASME Y14.5M-1994. All dimensions are in millimeters, angle is in degrees. N is the total number of terminal. ND and NE refers to the number of terminals on each side respectively. Terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must be located within the area indicated. The terminal #1 identifier may be either a mold, embedded metal or mark feature. 6. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. 7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.
www.austriamicrosystems.com
Revision 1.04
12 - 14
AS1371
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The device is available as the standard products listed in Table 5. Table 5. Ordering Information Ordering Code AS1371-BTDT-105 AS1371-BTDT-12* AS1371-BTDT-15* AS1371-BTDT-18* AS1371-BTDT-20* AS1371-BTDT-25* AS1371-BTDT-30* *) on request Non-standard devices from 0.6V to 3.3V are available in 50mV steps. For more information and inquiries contact http://www.austriamicrosystems.com/contact Marking AT AM AN AO AP AQ AR Output 1.05V 1.2V 1.5V 1.8V 2.0V 2.5V 3.0V Description 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO 400mA, Low Input Voltage, Low Quiescent Current LDO Delivery Form Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Package 6-pin 2x2 TDFN 6-pin 2x2 TDFN 6-pin 2x2 TDFN 6-pin 2x2 TDFN 6-pin 2x2 TDFN 6-pin 2x2 TDFN 6-pin 2x2 TDFN
Note: All products are RoHS compliant and Pb-free. Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect For further information and requests, please contact us mailto:sales@austriamicrosystems.com or find your local distributor at http://www.austriamicrosystems.com/distributor
www.austriamicrosystems.com
Revision 1.04
13 - 14
AS1371
Datasheet
Copyrights
Copyright (c) 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered (R). All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters austriamicrosystems AG Tobelbaderstrasse 30 A-8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact
www.austriamicrosystems.com
Revision 1.04
14 - 14

▲Up To Search▲

Price & Availability of AS1371-BTDT-105

	To Download AS1371-BTDT-105 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .